October 26, 2007 at 17:01AMD tri-core processor details
A pinch of detail has appeared on the Web regarding the new AMD tri-core processor. In particular, thanks to some sources among motherboard manufacturers, it became known that the mass release and distribution of new items will begin next year. In addition, some details were disclosed regarding the name and technical characteristics of the tri-core. So, the 65-nanometer Taliman processor will be designed for motherboards with an AM2 + connector, it will support HyperTransport 3.0 technology and will be equipped with 2 megabytes of L3 cache. Presumably, the appearance of Taliman in public will occur in March 2008.
The next generation of the AMD tri-core processor will be manufactured using the 45-nanometer process technology and will be intended for the AM3 socket, although support for HyperTransport 3.0 and DDR2 / DDR3 memory will, of course, not go anywhere. This modification will be released in the first half of 2009.
It should be noted that AMD itself has not made any official statements about tri-core so far, so all the information presented may turn out to be inaccurate.
via Digitimes
The next generation of the AMD tri-core processor will be manufactured using the 45-nanometer process technology and will be intended for the AM3 socket, although support for HyperTransport 3.0 and DDR2 / DDR3 memory will, of course, not go anywhere. This modification will be released in the first half of 2009.
It should be noted that AMD itself has not made any official statements about tri-core so far, so all the information presented may turn out to be inaccurate.
via Digitimes