Disassembling the Oppo Finder X907 smartphone

    Good day, Habrahabr!

    In the last topic review, we were talking about the design and software of the device, in other words, about the form. But, as you know, any work of art is a combination of form and content. Therefore, today we will continue our acquaintance with the Oppo Finder x907 smartphone and take a look under the hood of the device.



    The smartphone is equipped with a non-removable lithium-ion battery. This design feature allowed the company’s engineers to abandon the bulky and fragile back cover in favor of a prefabricated metal back, ensuring the solid structure and the complete absence of play.



    The back of the device is assembled in three parts. In order to access the inside of the device, it is necessary to remove the bottom protective cover, the battery cover and the camera cover one by one.



    The protective cover is securely fixed by five fasteners. Carefully insert the plastic pick into the gap between the piping and the lid, pry it off and remove it.



    Under the cover is a plastic antenna bracket. An external speaker is mounted in it. Nearby is a vibration motor.



    We insert the mediator between the inner wall of the edging and the support console. After making sure that all the fasteners are open, remove the bracket.



    Slide the battery cover down.



    The Oppo Finder uses a lithium-ion battery with a capacity of 1,500 milliampere-hours. More precisely, the stored charge is 1500 mA * h, and the stored energy is 5.5 W * h. The voltage value is 3.7 V.



    We open the plastic plug of the micro-USB connector. Insert the pick into the recess between the power connector and the cover. Remove the camera lid. The outer flat lens is made of tempered Corning Gorilla Glass, which is scratch resistant.



    Let's take a closer look at the printed circuit board. On the back side there is a photosensitive CMOS sensor of the main camera. The resolution of the matrix is ​​8 megapixels. The default aperture value is f / 2.6. The focal length is 3 mm. By default, the ISO value is 100, it is not possible to change it using regular means. To the right of the camera module are two LED flash LEDs.



    To access the front of the board, you must remove it from the case. With tweezers, we remove the plastic brackets from the antennas of the GPS receiver and Wi-Fi transmitter one by one.



    We unscrew the three screws securing the circuit board.



    Carefully disconnect the display cable from the LCM of the BTB connector and the antenna cable of the BTB board.



    We pry the board and raise it above the case.



    We release the battery clamp, disconnect the RF cable from the board and the FPC antenna.





    Slide the board down and remove it.



    An inconspicuous chip labeled Qualcomm is a system based on the MSM8260 chip, which belongs to the third generation of the Snapdragon family. SOC contains Scorpion's high-performance dual-core CPU, which is based on a modified ARM Cortex-A9 processor core with ARMv7 instruction set. The maximum clock frequency is 1.5 GHz. The processor is equipped with a 512 KB second-level cache. The applied technological process is 45 nanometers. More detailed information is contained in official documents: here and here .



    Accelerator Adreno 220, manufactured by Imageon, supports most common graphic libraries, such as: OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1, EGL 1.3, Direct3D Mobile, SVGT 1.2, Direct Draw, GDI; and can count up to 88 million triangles per second. The standard core frequency is 266 MHz, the maximum is 400. Samsung's MCP chip



    is responsible for data storage , combining 16GB of ROM and 1GB of LPDDRII type RAM. Audio is processed by a digital amplifier YAMAHA YDA145 with a maximum output power of 2.1W. You can download the chip documentation from the official YAMAHA website .







    A graphite-based thermally conductive pad is used to cool the chip. A similar SOC is used in smartphones Sony Xperia (Ion, S, SL, Arco S), HTC Sensation and Sensation SL, Xiaomi MI-One S. The

    front CMOS camera has a resolution of 1.3 Mpx. Supports video recording up to 720p at 16 frames per second. To the right of the camera is a light sensor.



    The battery is attached to the bottom cover of the support structure using double-sided tape. We place a technical scalpel between them and carefully remove the battery, applying a proportional force.



    We remove the display using an industrial hair dryer. Set the temperature to about 100º, and the flow rate at 3-4. Alternately heat the corners of the touch screen until the glass starts to burn your hand. Then, using the suction cup, remove the display.



    The display is based on Super Amoled Plus technology developed by Samsung. Resolution - 800x480 pixels with a diagonal of 4.3 inches, which gives 217 DPI. It displays up to 16 million colors. Viewing angles are maximum. Capacitive type sensor. There is no air gap between the touch panel and the matrix.



    At the back of the display is a 224-channel Atmel mXT-224 touch screen controller. The controller recognizes up to 10 simultaneous touches with a minimum interval of 10 mm. The maximum scanning frequency is about 250 Hz. Documentation and specifications on the manufacturer’s website and description of the chip in Russian .



    In order to remove the antenna - it is necessary to remove the plastic retainer, and then the contact elements, pre-heating them. After - we heat the antenna until the double-sided tape softens, and remove it.



    The final touches. The smartphone is completely disassembled!


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