September 4, 2012 at 05:11Creating a double-sided board (video)
Hi Habr!
I think that LUT technology is not a secret for anyone. A rare electronic blog goes without an article on how to iron a circuit board. But the topic of creating double-sided boards for some reason is covered much less frequently. Although they are becoming more popular: we use microcircuits in small and multi-legged cases, and try to reduce the size of the board.
I want to share with you the video that I made during the production of the next board. It demonstrates well one of the methods for creating a double-sided board.
A few comments on the video:
- It is convenient to take a piece of PCB larger than the board. Then it will be easier to align it in a “sandwich”. And you can trim after etching.
- Before removing the paper from the PCB (this can be done without soaking the board, if the paper is good), let it cool.
- You can print two sides at once in one go. The advantage of this approach is that it will be easier to combine them, and the disadvantages are the complexity of implementation. For example, in Sprint Layout you have to copy the board twice and remove unnecessary layers from each copy. Manually.
- vias can be soldered with a thin wire (one or two wires from the loop wiring). The wire is threaded into the hole, bent to the track and soldered. True, it is not convenient to place microcircuits in such small (TSSOP, TQFP and smaller) cases on such a metallization, since the wire rises noticeably above the board. An alternative may be a chemical tin plating, which is about here describes comrade. evsi (he has a couple more posts on this topic there).
I think that LUT technology is not a secret for anyone. A rare electronic blog goes without an article on how to iron a circuit board. But the topic of creating double-sided boards for some reason is covered much less frequently. Although they are becoming more popular: we use microcircuits in small and multi-legged cases, and try to reduce the size of the board.
I want to share with you the video that I made during the production of the next board. It demonstrates well one of the methods for creating a double-sided board.
A few comments on the video:
- It is convenient to take a piece of PCB larger than the board. Then it will be easier to align it in a “sandwich”. And you can trim after etching.
- Before removing the paper from the PCB (this can be done without soaking the board, if the paper is good), let it cool.
- You can print two sides at once in one go. The advantage of this approach is that it will be easier to combine them, and the disadvantages are the complexity of implementation. For example, in Sprint Layout you have to copy the board twice and remove unnecessary layers from each copy. Manually.
- vias can be soldered with a thin wire (one or two wires from the loop wiring). The wire is threaded into the hole, bent to the track and soldered. True, it is not convenient to place microcircuits in such small (TSSOP, TQFP and smaller) cases on such a metallization, since the wire rises noticeably above the board. An alternative may be a chemical tin plating, which is about here describes comrade. evsi (he has a couple more posts on this topic there).