Microsoft revealed the details of the new architecture XBox 360 250 GB
Surely, the owners of the first XBox 360 models still have fresh memories of problems with the console overheating (RROD, Red Ring of Death). Following the Falcon and Jasper models, they significantly improved the situation, minimizing overheating problems.
When Microsoft introduced the new XBox 360 250GB and 4GB onboard models, many skeptics said that with a decrease in the size of the console, the temperature regime could change and problems with overheating would return. However, Microsoft immediately made it clear that it does not intend to step on the same rake again.
Today, the XBox Team shared information about the new architecture used in models codenamed XBox 360 S (Valhalla). With the help of IBM engineers, Microsoft combined the 3-core CPU, ATI graphics core, video memory, dual-channel memory controller and I / O logic into a single System-On-Chip (SoC). The first of its kind SoC for a wide consumer market, manufactured at IBM / GlobalFoundries with 45nm process technology.
The use of this SoC will positively affect both the temperature regime of the XBox and the final cost. The new System-On-Chip contains just 372 million transistors. For comparison, in the 2006 Pentium D 900 there were 376 million tons, while the 45nm Core i5-760 will have more than 774 million tons.
According to ArsTechnica
When Microsoft introduced the new XBox 360 250GB and 4GB onboard models, many skeptics said that with a decrease in the size of the console, the temperature regime could change and problems with overheating would return. However, Microsoft immediately made it clear that it does not intend to step on the same rake again.
Today, the XBox Team shared information about the new architecture used in models codenamed XBox 360 S (Valhalla). With the help of IBM engineers, Microsoft combined the 3-core CPU, ATI graphics core, video memory, dual-channel memory controller and I / O logic into a single System-On-Chip (SoC). The first of its kind SoC for a wide consumer market, manufactured at IBM / GlobalFoundries with 45nm process technology.
The use of this SoC will positively affect both the temperature regime of the XBox and the final cost. The new System-On-Chip contains just 372 million transistors. For comparison, in the 2006 Pentium D 900 there were 376 million tons, while the 45nm Core i5-760 will have more than 774 million tons.
According to ArsTechnica