USB 3.0 will be an optical interface

    At an ongoing IDF forum, Intel's senior vice president, Pat Gelsinger, spoke not only about the new server flash drives, but also about much more interesting things. In particular, about the next generation of the USB bus.

    The creation of USB 3.0 technology, the development of which is currently at the initial stage, Intel is working in collaboration with Microsoft, Hewlett-Packard, Texas Instruments, NEC and NXP Semiconductors. According to Gelsinger, the USB 3.0 bus will be able to provide a 10-fold increase in speed compared to the current USB 2.0, and the peak bandwidth will reach 4.8 Gb / s. All this will be possible thanks to the use of optical and copper connecting cables. It is important to note that this will ensure backward compatibility, so that the old hardware will work on the new bus without any problems. However, with all the promised benefits, the developers, apparently, are not going to cope with one important problem - the relatively high CPU load.

    The developers plan to introduce the first version of the USB 3.0 specification in the first half of next year, and the production of the corresponding devices will begin in 2009 or 2010.

    Via CNET's

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