The thinnest semiconductor substrate

    Korean company Samsung recently announced the creation of a substrate for the production of semiconductors, the thickness of which is only 0.08 mm. This is 20% less than the 0.1 mm substrate Samsung launched in 2005. All the salt is that thanks to such a small thickness, the new substrate will allow the production of twenty-layer static and flash memory chips.

    So far, Samsung has just begun to provide interested companies with the first test samples of a 0.08 mm substrate. According to company representatives, Samsung plans to start mass production of the new product by the end of 2007.

    via Russan Mobile

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